Unicomp: Guarding the Trillion-Dollar AI Computing Market with Nanoscale Insights
According to NVIDIA CEO Jensen Huang, the global market for AI computing power will reach $1 trillion (≈7 trillion RMB) by 2027. At the current growth rate, it could exceed $10 trillion after 2030.
The hardware side of the AI supply chain is a complex journey—from sand to supercomputing clusters—spanning critical links:
- AI chip design (GPU/ASIC)
- Advanced wafer fabrication
- State-of-the-art packaging
- High-bandwidth memory (HBM)
- High-speed optical modules (800G/1.6T)
- Thermal management systems
- AI server manufacturing
Across this end-to-end chain—from chip design to full-scale computing clusters—the core challenge is clear:
How to assemble multiple chips like Lego bricks, break through the "memory wall," and unlock exponential AI performance gains.
This is where X-ray inspection emerges as the ultimate quality guardian. With non-destructive, penetrating, and 3D imaging capabilities, it sees through the "black box" of AI hardware, ensuring reliability from nanoscale transistors to system-level packaging.
As a leader in X-ray inspection, Unicomp Technology leverages nanoscale X-ray tubes and AI-powered industrial inspection to safeguard the AI supply chain—enabling scalable, cost-effective, intelligent, and high-yield production.
Unicomp Technology: Fast Nanoscale CT
Unicomp Technology leverages its fast nanoscale CT technology, combined with intelligent multimodal imaging and AI-powered inspection algorithms, to break the limits of traditional detection methods. It achieves precise identification of submicron-level defects such as TSV voids, bump bridging, and cold solder joints.
AI Slice Positioning
Tackling Complex Stacked Structures
After advanced packaging and chip stacking, severe mutual interference occurs among inspection objects.
Comparison: CT slices before and after artifact removalTrained on Unicomp’s billion-scale high-quality inspection database, the AI model learns to distinguish subtle textures (striations, rings), normal structures, edge shadows from real defects (voids, cracks). It filters out noise, enhances defect signals, identifies and eliminates artifacts, thereby reducing false positives.
Nanoscale Perspective, Capturing Micro Defects
In advanced packaging, inspection targets such as TSVs, TGVs and bumps, along with their defect features, are extremely tiny — making them hard to be clearly distinguished by conventional CT systems.
With a nanoscale focal spot size, geometric blurring is greatly reduced. Ultra-high magnification delivers sharp imaging of internal chip structures and enables precise localization of submicron-level defects.Multi-modal Imaging for Efficient Analysis
Some chips are sensitive to X-ray radiation dosage and cannot endure long exposure time, while CT scanning is still indispensable for inspection. Balancing testing time, image quality and radiation dosage has long been a major challenge.
•2D Imaging •2.5D Imaging
•Cone Beam CT Imaging•Slice CT Imaging
Supported by multi-modal imaging including 2D, 2.5D, cone beam CT and slice CT, Unicomp splits time-consuming full-chip CT scanning into second-level 2D imaging + high-speed directional CT scanning. This effectively lowers radiation dosage during inspection and solves the dilemma of safe yet efficient defect detection.
As one of the very few domestic enterprises that have independently mastered the core technology of nanoscale open-tube X-ray sources, Unicomp Technology has broken overseas technological monopoly.
At present, given the low localization rate and vast substitution potential of advanced packaging inspection equipment, the company is actively advancing the market rollout of specialized advanced packaging inspection systems equipped with self-developed nanoscale open-tube X-ray sources.
Meanwhile, through the acquisition of Singapore’s SSTI, Unicomp has established full-chain inspection capabilities spanning chip design, wafer fabrication, and packaging and testing. Centered on "physical + functional" dual-modal inspection, it delivers solutions to nearly half of the world’s top 20 semiconductor manufacturers, demonstrating robust market and technological competitiveness.
The Future
Unicomp Technology will leverage AI-powered, platform-based inspection capabilities to deliver critical quality infrastructure for the AI computing revolution, driving global AI industry advancement.
Unicomp Technology will leverage AI-powered, platform-based inspection capabilities to deliver critical quality infrastructure for the AI computing revolution, driving global AI industry advancement.
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TO SEE THE FUTURE
Unicomp – Insights into Tomorrow
Unicomp – Insights into Tomorrow
