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Kualitas Papan Elektronik Mesin X-ray 2D & 2.5D AX9100MAX Dengan Tabel Rotasi 360 derajat Untuk BGA&PCB Pabrik

Papan Elektronik Mesin X-ray 2D & 2.5D AX9100MAX Dengan Tabel Rotasi 360 derajat Untuk BGA&PCB

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.

Kualitas Mesin X-ray PCB dengan perbesaran tinggi Unicomp AX9100MAX untuk pemeriksaan kabel ikatan komponen IC elektronik Pabrik

Mesin X-ray PCB dengan perbesaran tinggi Unicomp AX9100MAX untuk pemeriksaan kabel ikatan komponen IC elektronik

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray Tube Tube Type Type Sealed type

Kualitas IC Curvature Measurement Unicomp AX9100MAX Mesin X-Ray dengan ukuran piksel 84μm dan sudut miring 60° Pabrik

IC Curvature Measurement Unicomp AX9100MAX Mesin X-Ray dengan ukuran piksel 84μm dan sudut miring 60°

It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray

Kualitas SMT PCB X-Ray Machine Unicomp AX9100MAX Resolusi Tinggi Mikron Fokus Spot Ukuran untuk BGA Voids dan Solder Paste Inspection Pabrik

SMT PCB X-Ray Machine Unicomp AX9100MAX Resolusi Tinggi Mikron Fokus Spot Ukuran untuk BGA Voids dan Solder Paste Inspection

It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption

Kualitas 130KV Micron Focus Spot Size Tube X-Ray Machine Unicomp AX9100 Model yang Diperbarui AX9100MAX Dengan Komputer Dual Untuk Pemeriksaan PCB&BGA Pabrik

130KV Micron Focus Spot Size Tube X-Ray Machine Unicomp AX9100 Model yang Diperbarui AX9100MAX Dengan Komputer Dual Untuk Pemeriksaan PCB&BGA

It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4

Kualitas Papan Elektronik Spesifikasi Tinggi Mesin X-Ray 2D & 2.5D Unicomp AX9100MAX Dengan Meja Rotasi 360 derajat Untuk Pemeriksaan BGA Dan PCB Pabrik

Papan Elektronik Spesifikasi Tinggi Mesin X-Ray 2D & 2.5D Unicomp AX9100MAX Dengan Meja Rotasi 360 derajat Untuk Pemeriksaan BGA Dan PCB

It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight

Kualitas Otomatis NDT X Ray Peralatan Sistem, Aluminium Roda Hub Inspeksi Mesin Pabrik

Otomatis NDT X Ray Peralatan Sistem, Aluminium Roda Hub Inspeksi Mesin

Automatic Aluminium Wheels Hub Inspection NDT X Ray Equipment System The inspection systems are mostly integrated as inline-systems in a foundry. Most requirements of an inspection system are based on detection of defects and on the inline - integration in an industrial environment. 1. high availability (approx. > 95%) 2. high throughput (>80 wheels per hour) 3. detection of all relevant defects with a minimum of false rejects 4. minimum of maintenance effort 5. easy system

Kualitas In-line Daya Laminasi Baterai Lithium X Ray Machine LX-1D12-100 Pabrik

In-line Daya Laminasi Baterai Lithium X Ray Machine LX-1D12-100

In-line Laminated Power Lithium Battery X-ray Detector LX-1D12-100 Features: 1, micro-focus tube, the image is more clear; 2, automatic loading and unloading, more labor; 3, the magnification can be adjusted; 4, easy parameter setting, automatic judgment sorting bad product; 5, user-friendly software interface, easy to get started; 6, fully automated operations, reduce manpower, reduce production costs, improve production efficiency and quality consistency; 7, the software

Kualitas In-line Silinder Silinder Baterai X Ray Machine dengan desain yang berorientasi Keselamatan Pabrik

In-line Silinder Silinder Baterai X Ray Machine dengan desain yang berorientasi Keselamatan

In-line Cylindrical Lithium Battery X-ray Detector with Safety-oriented design The lithium battery X-Ray detection equipment of multiple types and full automation solely-developed by Unicomp Technology is targetted to inspect cells alignment metric and tabs soldering quality . It improves automation as well as gains high-definition internal images by means of X-ray imaging technology . This technology is widely applied to the detection of lithium battery in various types