bga inspection equipment
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Tabung Tertutup Peralatan SMT X Ray AX8200 8W Untuk Modul Elektronik Otomotif
Applying 5micro closed tube AX8200 X-ray for Automotive Electronics Modules quality defects control Other Special Industries. Item Definition Specs System Parameters Size 1080(L)X1180(W)X1730(H)mm Weight 1150kg Power 220AC/50HZ Power Consumption 0.8KW X-Ray Tube Type Closed Max.Voltage 90kv/100kv Max.Power 8W Spot Size 5μm X-Ray System Intensifier 4"Image Intensifier Monitor 22"LCD System Magnification 600X Detection Region Max.Loading Size 510mm x 420mm Max.Inspection Area
CX3000 Benchtop Electronics X Ray Machine untuk BGA, CSP, LED & Semiconductor
CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor X ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. X ray Inspecting Features: (1) Coverage of process defects up to 97%.
Mesin Inspeksi Baterai Lithium CSP 5KW AX8800 0.2mA
Cabinet Lithium Battery Automatic X-ray Inspection Machine AX8800 Applications: ● Lithium battery pole piece solder joint defect detection, ● Lithium battery batteries coiling case detection, ● BGA , CSP , LED , Flip Chip , Semiconductor, ● Battery Industry , Small Metal Casting, ● Electronic Connector Module, ● Aerospace Components , Photovoltaic Industry , ● Other Special Industries. Aftersales service: Ø A professional service team Ø Country-wide network Ø 24/7 hotline Ø
Detektor FPD 1kW 90KV EMS Inspeksi Peralatan Sinar X
Application BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB Semiconductor , Battery Industry , Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry Features • 90kV 5µm closed X-ray tube, digital flat panel with 2 mega pixels CCD camera • Multi-function DXI image processing system, CNC programmable detection • Max. loading area 500mm*450mm, max. inspection area 500mm*450mm, with 600X Magnification • Multi-function workstation with
AX8500 SMT / EMS X Ray Machine, Peralatan Inspeksi Xray Jenis Tabung Tertutup
AX8500 Metal X Ray Machine for Micro BGA / chip on chop analysis Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm Tilt Detection Angle 60° X-Ray System Tube Type Closed Voltage/Current 100kv/200μA Focal Spot Size 5μm FPD Detector FPD Physical & Image Processing Parameters Length x Width x Height 1250 x 1300 x 1900 mm Weight 1500 kg Power 2kW System Magnification 500 x Leakage
Unicomp X-ray AX8300 Plus Semikonduktor Microfocus Peralatan Pemeriksaan Sinar X
Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 2 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel
Sistem Pemeriksaan Inline Unicomp LX9200 X Ray Presisi Tinggi Untuk Analisis PCB / BGA
Inline High-Precision 3D X-Ray Tomography for PCB and BGA Analysis Unicomp LX9200 X-Ray inspection system Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type: BGA, LGA, CSP, POP, SIP... Defect type: Void, HIP, Insufficient, Bridge... Semiconduc
Peralatan Deteksi Sinar X Tabung Tertutup FDA 90KV Untuk Cacat Resistensi
FDP 90KV X-Ray Machine For Resistance Defects DetectingApplicationsBGA InspectionInspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection EMS Semiconductor Electronics X Ray Machine System for BGA and CSP
Mesin X-Ray Elektronik BGA 90kV Untuk Solder Fotovoltaik Surya
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
