pcb inspection system
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Unicomp AX9100 Pengukuran otomatis dengan pemrograman CNC peralatan X-Ray untuk kualitas solder PCBA BGA CSP QFN reflow
Unicomp AX9100 Automatic measurement with CNC programming X-Ray equipment for PCBA BGA CSP QFN reflow soldering quality Features of Unicomp AX9100: ● 90-130KV 7μm X-Ray tube.● High speed & Millions pixels high resolution FPD.● 1000X magnification, high-definition real-time image.● One-button operation with 2.5D image display.● Off-line programming function, navigation mode detection.● 7 axis linkage, 70 degree tilt detection.Applications of Unicomp AX9100: ● SMT, BGA, CSP,
Cina X-ray mesin manfuacturer Unicomp microfocus 130kV X-ray AX9100 dengan 2.5D FPD tampilan miring untuk PCBA IC BGA PTH
China X-ray machines manfuacturer Unicomp microfocus 130kV X-ray AX9100 with 2.5D FPD oblique view for PCBA IC BGA PTH Features of X-ray AX9100: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications of X-ray AX9100: ● SMT, BGA, CSP,
Unicomp Inline Electronics X Ray Machine 3.5kW Untuk Solder Semicon IGBT
Unicomp Inline Electronics X Ray Machine 3.5kW For IGBT Semicon Soldering Unicomp High Speed Inline 2D X-ray Inspection machine with cutting edge AI Algorithm For IGBT Semicon soldering void checking Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight
Solder Quality X-Ray Detection X-Ray System untuk lampu LED kendaraan
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Mesin Las X Ray Semikonduktor Resolusi Tinggi 90KV 5um
90kV 5um High Resolution And Long Lifespan X-Ray Machine For SMD PCBA Soldering Qualtiy Inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and
Semikonduktor 110kV Elektronik X Ray Machine 5um AX8500 Untuk PCBA BGA
110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
5um SMT X Ray Equipment CNC Programmable Untuk EMS BGA Voids
5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
Unicomp AX8500 110kV 5um 2.5D X-ray untuk Elektronik SMT PCBA BGA IC solder pemeriksaan kualitas
Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
2.5D 110kv X ray machine Unicomp AX8500 untuk pemeriksaan kualitas leadframe Semicon dengan pengukuran otomatis
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
