real time x ray system
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Papan Elektronik Mesin X-ray 2D & 2.5D AX9100MAX Dengan Tabel Rotasi 360 derajat Untuk BGA&PCB
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Mesin X-ray PCB dengan perbesaran tinggi Unicomp AX9100MAX untuk pemeriksaan kabel ikatan komponen IC elektronik
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray Tube Tube Type Type Sealed type
IC Curvature Measurement Unicomp AX9100MAX Mesin X-Ray dengan ukuran piksel 84μm dan sudut miring 60°
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
SMT PCB X-Ray Machine Unicomp AX9100MAX Resolusi Tinggi Mikron Fokus Spot Ukuran untuk BGA Voids dan Solder Paste Inspection
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
130KV Micron Focus Spot Size Tube X-Ray Machine Unicomp AX9100 Model yang Diperbarui AX9100MAX Dengan Komputer Dual Untuk Pemeriksaan PCB&BGA
It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4
Papan Elektronik Spesifikasi Tinggi Mesin X-Ray 2D & 2.5D Unicomp AX9100MAX Dengan Meja Rotasi 360 derajat Untuk Pemeriksaan BGA Dan PCB
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
80KV Makanan Dan Minuman Mesin Deteksi X Ray Scanner Keramik Batu Dapat Botol Jus
Metal foreign Materials Ceramic Stone X Ray detection Machine Scanner Application: Food security: all kinds of meat, seafood, fruits and vegetables, additive, milk, chocolate and other foreigh matter inside the test. Foreigh body include: metal, glass, ceramic, stone, bone, plastic. Foreign body checking luggage, handbags, toys, shoes, clothing, hardware accessories, electronic components, such as : product quality testing. Features: Easy to operate with mouse and keyboard Hi
AX9100max Elektronik Mesin Sinar X Dengan Fixed-Point Following Selama FPD Miring
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Foundries Low Density 2d X Ray Inspection Machine 130KV Operation Stability
130KV Foundries Low Density Industrial 2D X-ray Inspection Systems 1. High resolution, subtle defect recognition ability to upgrade with the imported 5um micro focus source 2. Save the detection time of the bulk of the work piece via the CNC programmable control 3. No dead angle detection with C-arm five-axis motion detection mechanism 4. Servo stepper motor drive to make the operation stability 5. Voltage regulator, isolation, filtering, grounding and other protective