x ray equipment
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Elektronik Multi-Fungsi Mesin X Ray Kecepatan Tinggi Real Time Untuk Bola Emas
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing
PCB BGA Inspeksi Elektronik Mesin X Ray Bola Golf Di Dalam Pemeriksaan Kualitas
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable
Mesin X Ray Industri CE 320kV Untuk Bagian Pengecoran Besi
Dynamic Precise Casting Part Inspection Real Time X-ray Image System The UNC320 is the newest standard system. Whether you are inspecting small or large components, the UNC320 is the best option for customers needing a compact system with unique capabilities generally available on a larger X-ray or CT system. SYSTEM CAPABILITIES Advanced 2D X-ray inspection Overall Maximum System Resolution: ~5 microns 50cm diameter x 80cm tall nominal part envelope Comprehensive acquisition,
Microfocus Unicomp Pcb X Ray Inspection Machine 1080mmx1180mmx1730mm
Unicomp X-ray Machine Electronics LED BGA Standard Multipurpose Features: ● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera. ● Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement. ● Multi-function DXI image processing system ● X/Y programming function for multiple image inspection routines ● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X System Magnification. BGA void/area auto
NDT Real Time X Ray Inspection Equipment 60mm Penetration High Density Resolution
High Density Resolution NDT Real Time X Ray Image System 60mm Penetration The excellent image quality of the UNC450 system is based on the interplay of the digital flat-panel detector array with our Unicomp software. The technology provides exceptional detail detection, even though varying material thicknesses, and assists in visually determining the depth of casting flaws. Applications: Aerospace Automotive Foundries Science & Research Weld inspection 1. CNC programmable
Industri Otomatis Peralatan NDT X Ray Definisi Tinggi Pengujian Tidak Merusak Umur Panjang
Non-Destructive Testing (NDT) servicing the requirements of the auto industry ●Strong penetration,high reliable,low breakdown, long life; ●High definition,resolution FPD; ●Multi-functional workstation,360°rotation and shift; ●High automation,fast detection speed; ●User friendly software design for interfacing and to facilitate,customize software function development requirement. For over 15 years X-Ray inspecting, a division of X-Ray industries, has been committed to
1kW 1uSv / H 90KV X Ray Scanning Machine Untuk Pencahayaan LED
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sµm closed X-Ray tube, HD digital flat panel Max. loading area 1300 x 650mm, Max. inspection area 1300 x 700mm ;600x Magnification
Tabung Finefocus 100KV X Ray Scanner AX8200 Untuk Pemeriksaan PCBA
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. Technical Data
Baterai Lithium Elektronik Mesin X Ray Unicomp AX8200B
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
