x ray imaging system
"
Tutup Tabung Unicomp X Ray AX8200 Max 5μM Untuk Elektronik Otomotif
Using Unicomp AX8200Max close tube Microfocus X-ray to detect Automotive electronics inner quality defects Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control,
Pengukuran Otomatis Mesin Unicomp AX8200MAX 2.5D X Ray Untuk PCBA BGA QFN
Unicomp AX8200MAX 2.5D X-ray machine for PCBA BGA QFN soldering voids Auto measurement Application Fields of AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of AX8200max 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate
Real Time Unicomp X Ray Machine AX8200MAX 5 Micron Closed Tube Untuk SMT EMS BGA Void Check
Real-time X-Ray machine Unicomp AX8200MAX with 5 micron closed tube for SMT EMS BGA void check Application Fields of BGA Xray machine Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of BGA Xray machine 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD
Wire Harness Welding BGA X Ray Machine 2.5D Micro Focus Inspection AX8200MAX
Wire Harness Welding Quality Inspection by 2.5D micro focus X Ray Machine AX8200MAX Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of BGA Xray machine AX8200max 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive
Mesin Inspeksi Unicomp AX8200max X Ray Untuk Inspeksi Cacat Kawat Harness
Unicomp AX8200max X-ray Inspection machine for Wire Harness Defects Inspection Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Technical Specifications of BGA Xray machine AX8200max System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC
Unicomp 90kV 5um Microfocus X Ray Tube Untuk Pemeriksaan Komponen Elektronik Palsu
Unicomp 90kV 5um Microfocus X-ray Tube for Electronics Component Counterfeit Inspection Key Parameter Max. Tube Voltage: 90kV Max. Tube Power: 8W Min. Spot Size:
UNC160 Mesin inspeksi NDT sinar-X untuk bagian casting 480w Light Tube Power Services
Product Description: Our Industrial Inspection Equipment is equipped with a Sealed X-ray Tube Type that ensures high-level safety while conducting tests and scans. It is mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body, and metal parts welding. Our team of experts is always ready to help customers analyze their product projects and provide detection solutions. We also offer a free sample
380AC/50Hz Power Supply UNC160 Mesin Inspeksi NDT Sinar X untuk Cacat Dalam
UNC160 X-Ray NDT Inspection Machine Explore Castings Inner Defects Product Description: Our Industrial Inspection Equipment boasts a Sealed X-ray Tube Type that guarantees unparalleled safety during testing and scanning procedures. It finds extensive application in the examination of metal castings, hardware, plastics, refractory materials, review materials, ceramic bodies, and welded metal components. Our dedicated team of experts stands ready to assist customers in
Mesin sinar-X Unicomp AX9100max 2400kg untuk inspeksi tabung MOS
Unicomp X-ray AX9100max For Internal Defect Inspection Of MOS Tube Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
