x ray inspection system
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130KV Micron Focus Spot Size Tube X-ray Machine AX9100MAX Dengan Komputer Dual Untuk Pemeriksaan PCB&BGA
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Mesin X-ray PCB dengan perbesaran tinggi Unicomp AX9100MAX untuk pemeriksaan kabel ikatan komponen IC elektronik
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray Tube Tube Type Type Sealed type
130KV Micron Focus Spot Size Tube X-Ray Machine Unicomp AX9100 Model yang Diperbarui AX9100MAX Dengan Komputer Dual Untuk Pemeriksaan PCB&BGA
It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4
Papan Elektronik Spesifikasi Tinggi Mesin X-Ray 2D & 2.5D Unicomp AX9100MAX Dengan Meja Rotasi 360 derajat Untuk Pemeriksaan BGA Dan PCB
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
450KV Steel Pipe Cylinder Industrial X Ray Machine Unicomp Ulet Besi UNC450
450KV Steel Pipe Cylinder Industrial X Ray Machine Unicomp Ductile Iron UNC450 It is widely applied to inspect all kind of casting,NDT for air bubble,porosity and unwanted foreign.The equipment is applicable objects for NDT of cylinder welding defects and body,sidewall,lap,Crown steel cord and steel belt of tyre slag inclusion,crack,loosen and other flaws in hubs,pressure vessel,refractory material,bullet,boilr welded pipe and screwy pipe. Applications: Aerospace Automotive
Mesin X-ray PCB dengan perbesaran tinggi Unicomp AX9100MAX untuk pemeriksaan kabel ikatan komponen IC elektronik
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Ukuran titik fokus mikron mesin sinar-X SMT PCB untuk pengukuran ruang kosong BGA dan inspeksi ketinggian pendakian sebelumnya
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
SMT PCB X-Ray Machine Unicomp AX9100MAX Resolusi Tinggi Mikron Fokus Spot Ukuran untuk BGA Voids dan Solder Paste Inspection
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
Mesin sinar-X Unicomp AX9100max 130kV 65W untuk Inspeksi IGBT
Unicomp AX9100max X-ray Machine For IGBT The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
