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EMS Semiconductor BGA X Ray Sistem Mesin Inspeksi AX8200 0.8kW Konsumsi Daya

Properti Dasar
Tempat Asal: Cina
Nama merek: UNICOMP
Sertifikasi: CE, FDA
Nomor Model: AX8200
Properti Perdagangan
Jumlah Pesanan Minimum: 1set
Harga: can negotiate
Ketentuan Pembayaran: T/T, L/C
Kemampuan Pasokan: 300 set per bulan
Ringkasan Produk
EMS Semiconductor BGA X Ray Sistem Mesin Inspeksi AX8200 Fitur: ● tabung sinar X 100KV 5μm, penguat gambar dengan kamera CCD 2 mega piksel. ● Kontrol gerak meliputi: gerakan kemiringan ± 60 °, gerak meja X / Y ditambah sumbu Z dan gerakan detektor. ● Sistem pemrosesan gambar DXI multi fungsi ● ...

Detail Produk

Menyoroti:

sistem inspeksi bga x ray

,

mesin bga x ray

Name: BGA X Ray Inspection Machine
Application: SMT, EMS, BGA, Elektronika, CSP, LED, Chip Flip, Semikonduktor
Max.Power: 8W
X-Ray Leakage: <1uSv / h
Monitor: 22 "LCD
Power Consumption: 0.8kw
Deskripsi Produk

EMS Semiconductor BGA X Ray Sistem Mesin Inspeksi AX8200

Fitur:

● tabung sinar X 100KV 5μm, penguat gambar dengan kamera CCD 2 mega piksel.

● Kontrol gerak meliputi: gerakan kemiringan ± 60 °, gerak meja X / Y ditambah sumbu Z dan gerakan detektor.

● Sistem pemrosesan gambar DXI multi fungsi

● Fungsi pemrograman X / Y untuk rutinitas pemeriksaan gambar ganda

● Maks. loading area 510mm x 420mm, max. area deteksi 435 x 385mm dengan Pembesaran Sistem 300X.

Barang

Definisi

Spesifikasi

Parameter Sistem

Ukuran

1080 (L) x1180 (W) x1730 (H) mm

Berat

1150kg

Kekuasaan

220AC / 50Hz

Konsumsi daya

0.8kW

Tabung sinar-X

Mengetik

Tutup

Max.Voltage

90kV / 100kV

Kekuatan penuh

8W

Ukuran Spot

5μm

Sistem sinar-X

Lebih intensif

4 "Image Intensifier

Pantau

22 "LCD

Pembesaran sistem

600x

Daerah Deteksi

Ukuran Load.Loading

510mm x 420mm

Area Max.Inspection

435mm x 385mm

Kebocoran sinar X

<1uSv / h

 

Full Automatic BGA Testing Procedures

1. Klik mouse sederhana pemrograman tanpa perlu intervensi operator pada komponen dapat mendeteksi setiap BGA secara otomatis.

2. Tes BGA otomatis, secara akurat memeriksa jembatan, pengelasan, pengelasan dingin dan rasio void BGA.

3. Uji coba BGA secara otomatis hasil uji coba ulang agar proses kontrol

4. Hasil tes akan ditampilkan di layar dan bisa di output ke Excel untuk memudahkan review dan pengarsipan

Pemrograman NC

1.Sebuah operasi klik mouse sederhana menulis prosedur uji

2.Pengaturan bisa jadi X, posisi direktur Y; X-ray tube dan detector Z positioning.

3.Software pengaturan tegangan dan arus

Pengaturan 4.Image: brightness, contrast, auto gain dan exposure

5.Pengguna dapat mengatur waktu beralih waktu pause program

6.Anti-tabrakan sistem dapat memenuhi kemiringan maksimum dan mengamati objek


Gambar Inspeksi:


Peringkat Keseluruhan
5.0
★★★★★
★★★★★
Berdasarkan 50 ulasan baru-baru
5 BINTANG
100%
Bintang 4
0
3 Bintang
0
Bintang 2
0
1 bintang
0
Semua Ulasan
  • M
    Marek
    Hungary Feb 10.2026
    ★★★★★
    ★★★★★
    The machine is excellent, the service is satisfactory, and the technology is highly professional.
  • P
    Peter
    France Feb 20.2025
    ★★★★★
    ★★★★★
    good product
  • S
    Smith
    Germany May 16.2024
    ★★★★★
    ★★★★★
    Stable product quality , reliable cooperation partner
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