Mesin Inspeksi BGA X Ray yang Efisien Tinggi, Sistem Kabinet Ray X Focus Micro
Properti Dasar
Tempat Asal:
Cina
Nama merek:
UNICOMP
Sertifikasi:
CE, FDA
Nomor Model:
CX3000
Properti Perdagangan
Jumlah Pesanan Minimum:
1set
Harga:
can negotiate
Ketentuan Pembayaran:
T/T,L/C
Kemampuan Pasokan:
Set 30 per bulan
Ringkasan Produk
Sistem kabinet x-ray fokus mikro BGA X-Ray Inspection Machine Barang Definisi Spesifikasi Parameter Sistem Ukuran 750 (L) x570 (W) x890 (H) mm Berat 300kg Kekuasaan 220AC / 50Hz Konsumsi daya 0.5kW Tabung sinar-X Mengetik Tutup Max.Voltage 100kV Kekuatan penuh 200μA Ukuran Spot 5μm Detektor Lebih ...
Detail Produk
Menyoroti:
sistem inspeksi bga x ray
,peralatan inspeksi bga
Name:
Mesin Inspeksi X-Ray BGA
X-Ray Coverage:
48mm x 54mm
Industry:
Industri elektronik
Resolution:
208Lp/cm
X-Ray Leakage:
< 1uSv/jam
Power Consumption:
0,5kW
Deskripsi Produk
Sistem kabinet x-ray fokus mikro BGA X-Ray Inspection Machine
| Barang | Definisi | Spesifikasi |
| Parameter Sistem | Ukuran | 750 (L) x570 (W) x890 (H) mm |
| Berat | 300kg | |
| Kekuasaan | 220AC / 50Hz | |
| Konsumsi daya | 0.5kW | |
| Tabung sinar-X | Mengetik | Tutup |
| Max.Voltage | 100kV | |
| Kekuatan penuh | 200μA | |
| Ukuran Spot | 5μm | |
| Detektor | Lebih intensif | FPD |
| Cakupan sinar-X | 48mm x 54mm | |
| Resolusi | 208Lp / cm | |
| Stasiun kerja | Ukuran Load.Loading | 200mm x 200mm |
| Area Max.Inspection | 200mm x 200mm | |
| Sudut Sudut Oblique | Perlengkapan rotari 360 ° (Opsional) | |
| Kebocoran sinar X | <1μSv / h | |
Sistem Inspeksi X-Ray adalah sistem pemeriksaan sinar-X berkinerja tinggi dengan rasio kinerja dan rasio yang tak terkalahkan dan mencakup semua fitur canggih yang Anda harapkan dapat ditemukan pada sistem pemeriksaan sinar-x yang jauh lebih mahal.
Aplikasi:
1.BGA / CSP / FLIPS CHIP:
Bridging, Voids, Membuka, Expcessive / tidak mencukupi
2.QFN: Menjembatani, Membatalkan, Membuka, Pendaftaran
Komponen standar 3.SMT:
QFP, SOT, SOIC, Chips, Konektor, Lainnya
4.Semikonduktor:
kawat ikatan, mati melampirkan VOID, MOLD, VOID
5.Multi-layer board (MLB):
Pendaftaran lapisan dalam, tumpukan PAD, vias buta / terkubur
Gambar Inspeksi:
Peringkat Keseluruhan
5 BINTANG
100%
Bintang 4
0
3 Bintang
0
Bintang 2
0
1 bintang
0
Semua Ulasan
-
MThe machine is excellent, the service is satisfactory, and the technology is highly professional.
-
JNICE
-
SStable product quality , reliable cooperation partner
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