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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Properti Dasar
Tempat Asal: Tiongkok
Nama merek: UNICOMP
Sertifikasi: CE, FDA
Nomor Model: AX9100maks
Properti Perdagangan
Jumlah Pesanan Minimum: 1 set
Harga: can negotiate
Ketentuan Pembayaran: L/C,T/T
Kemampuan Pasokan: 100set/bulan
Ringkasan Produk
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...

Detail Produk

Menyoroti:

Unicomp AX9100max X-ray inspection system

,

Flip-Chip BGA X-ray machine

,

FCBGA packaging analysis equipment

Monitor: Layar HD 27".
System OS: Windows10 64-bit
Hard Disk: 1 TB
RAM: 16g
CPU Model: i7
Deskripsi Produk
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application
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    United States Jan 21.2026
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