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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Sertifikasi
Cina Unicomp Technology Sertifikasi
Cina Unicomp Technology Sertifikasi
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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Gambar besar :  Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Detail produk:
Tempat asal: Tiongkok
Nama merek: UNICOMP
Sertifikasi: CE, FDA
Nomor model: AX9100maks
Dokumen: AX9100MAX-Dual screen.pdf
Syarat-syarat pembayaran & pengiriman:
Kuantitas min Order: 1 set
Harga: can negotiate
Kemasan rincian: Kayu Unikomp.
Waktu pengiriman: 15 hari
Syarat-syarat pembayaran: L/C,T/T
Menyediakan kemampuan: 100set/bulan
Detil Deskripsi produk
Monitor: Layar HD 27". sistem operasi: Windows10 64-bit
Harddisk: 1 TB RAM: 16g
Model CPU: i7
Menyoroti:

Unicomp AX9100max X-ray inspection system

,

Flip-Chip BGA X-ray machine

,

FCBGA packaging analysis equipment

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including:
  • BGA/CSP/Flip Chip packaging
  • LED & optoelectronic components
  • Fuse & diode manufacturing
  • PCB & semiconductor assembly
  • Battery production
  • Small metal castings
  • Electronic connector modules & cables
  • Photovoltaic (PV) cell inspection
Application Fields
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 0
Application fields of Unicomp AX9100max X-ray Machine
Functions and Features
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 1
Functions and features of Unicomp AX9100max X-ray Machine
Inspection Image
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 2
Sample inspection image from Unicomp AX9100max X-ray Machine
Technical Parameters and Specifications
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 3
Technical specifications of Unicomp AX9100max X-ray Machine
Dimensions and Appearance
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 4
Dimensions and appearance of Unicomp AX9100max X-ray Machine

Rincian kontak
Unicomp Technology

Kontak Person: Mr. James Lee

Tel: +86-13502802495

Faks: +86-755-2665-0296

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