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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Properti Dasar
Tempat Asal: Tiongkok
Nama merek: UNICOMP
Sertifikasi: CE, FDA
Nomor Model: AX9100maks
Properti Perdagangan
Jumlah Pesanan Minimum: 1 set
Harga: can negotiate
Ketentuan Pembayaran: L/C,T/T
Kemampuan Pasokan: 100set/bulan
Ringkasan Produk
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...

Detail Produk

Menyoroti:

Unicomp AX9100max X-ray inspection system

,

Flip-Chip BGA X-ray machine

,

FCBGA packaging analysis equipment

Monitor: Layar HD 27".
System OS: Windows10 64-bit
Hard Disk: 1 TB
RAM: 16g
CPU Model: i7
Deskripsi Produk
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including:
  • BGA/CSP/Flip Chip packaging
  • LED & optoelectronic components
  • Fuse & diode manufacturing
  • PCB & semiconductor assembly
  • Battery production
  • Small metal castings
  • Electronic connector modules & cables
  • Photovoltaic (PV) cell inspection
Application Fields
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 0
Application fields of Unicomp AX9100max X-ray Machine
Functions and Features
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 1
Functions and features of Unicomp AX9100max X-ray Machine
Inspection Image
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 2
Sample inspection image from Unicomp AX9100max X-ray Machine
Technical Parameters and Specifications
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 3
Technical specifications of Unicomp AX9100max X-ray Machine
Dimensions and Appearance
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis 4
Dimensions and appearance of Unicomp AX9100max X-ray Machine
Peringkat Keseluruhan
5.0
★★★★★
★★★★★
Berdasarkan 50 ulasan baru-baru
5 BINTANG
100%
Bintang 4
0
3 Bintang
0
Bintang 2
0
1 bintang
0
Semua Ulasan
  • T
    Tony
    Thailand Apr 15.2026
    ★★★★★
    ★★★★★
    It's useful for our product.
  • J
    J*n
    United Kingdom Mar 12.2026
    ★★★★★
    ★★★★★
    Good!
  • S
    Smith
    Germany May 16.2024
    ★★★★★
    ★★★★★
    Stable product quality , reliable cooperation partner
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