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IC BGA CSP QFN Packaging Inspection X-ray AX8300MAX UNICOMP 4K Flat Panel Detector

Properti Dasar
Tempat Asal: Cina
Nama merek: UNICOMP
Sertifikasi: CE, FDA
Nomor Model: AX8300MAX
Properti Perdagangan
Jumlah Pesanan Minimum: 1set
Harga: can negotiate
Ketentuan Pembayaran: T/T,L/C
Kemampuan Pasokan: 30 set per Bulan
Ringkasan Produk
AX8300MAX X-ray Inspection System Advanced industrial X-ray inspection system engineered for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality ...

Detail Produk

Menyoroti:

BGA packaging inspection X-ray machine

,

CSP X-ray detector with 4K resolution

,

QFN X-ray machine with flat panel

Model: AX8300MAX
Motion Control Mode: Tetikus & Papan Ketik & Joystick
Tilt And Rotation: Detektor kemiringan unilateral maksimum 60°
Monitor: Layar HD 4K 27".
System OS: Windows11 64-bit
Power Consumption: 900W
Tube Type: Tertutup
Deskripsi Produk
AX8300MAX X-ray Inspection System Advanced industrial X-ray inspection system engineered for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic components, new energy core parts, aluminum die castings, injection
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    United States Jan 21.2026
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