logo
Selamat datang di Unicomp Technology
+86-13502802495

5μm Minimum Resolution CNC Electronic BGA Package AX8300MAX Unicomp Missing Solder Ball QC Detector

Properti Dasar
Tempat Asal: Cina
Nama merek: UNICOMP
Sertifikasi: CE, FDA
Nomor Model: AX8300MAX
Properti Perdagangan
Jumlah Pesanan Minimum: 1set
Harga: can negotiate
Ketentuan Pembayaran: T/T,L/C
Kemampuan Pasokan: 30 set per Bulan
Ringkasan Produk
AX8300MAX Unicomp Missing Solder Ball QC Detector This advanced industrial X-ray inspection system delivers 5μm minimum resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection ...

Detail Produk

Menyoroti:

5μm resolution BGA detector

,

CNC electronic BGA package

,

missing solder ball QC detector

Model: AX8300MAX
Motion Control Mode: Tetikus & Papan Ketik & Joystick
Tilt And Rotation: Detektor kemiringan unilateral maksimum 60°
Monitor: Layar HD 4K 27".
System OS: Windows11 64-bit
Power Consumption: 900W
Tube Type: Tertutup
Deskripsi Produk
AX8300MAX Unicomp Missing Solder Ball QC Detector This advanced industrial X-ray inspection system delivers 5μm minimum resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of: Semiconductor packaging devices including BGA, CSP, LED and flip chip Automotive electronic components New energy core
Peringkat Keseluruhan
5.0
★★★★★
★★★★★
Berdasarkan 50 ulasan baru-baru
5 BINTANG
100%
Bintang 4
0
3 Bintang
0
Bintang 2
0
1 bintang
0
Semua Ulasan
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
Produk Terkait

Kirim Pertanyaan