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High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp

Properti Dasar
Tempat Asal: Cina
Nama merek: UNICOMP
Sertifikasi: CE, FDA
Nomor Model: AX9500
Properti Perdagangan
Jumlah Pesanan Minimum: 1set
Harga: can negotiate
Ketentuan Pembayaran: T/T,L/C
Kemampuan Pasokan: 300 Set per Bulan
Ringkasan Produk
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and ...

Detail Produk

Menyoroti:

FPD SMT X-ray inspection machine

,

BGA packaging X-ray machine

,

Unicomp AX9500 X-ray inspection

Name: Mesin Pemeriksaan Sinar-X Unicomp
Application: SMT, EMS,BGA, Elektronik, CSP, LED, Flip Chip, Semikonduktor
Industry: Industri elektronik
X-Ray Leakage: < 1uSv/jam
Deskripsi Produk
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, while also supporting SMT welding analysis with advanced 3D tomography CT scanning technology (planar CT + cone beam CT). Applications Semiconductor industry SMT
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