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High‑definition FPD Detector BGA Head‑In‑Pillow Defect AX9500 Unicomp SMT Welding Analysis System

Properti Dasar
Tempat Asal: Cina
Nama merek: UNICOMP
Sertifikasi: CE, FDA
Nomor Model: AX9500
Properti Perdagangan
Jumlah Pesanan Minimum: 1set
Harga: can negotiate
Ketentuan Pembayaran: T/T,L/C
Kemampuan Pasokan: 300 Set per Bulan
Ringkasan Produk
High-definition FPD Detector BGA Head-In-Pillow Defect AX9500 Unicomp SMT Welding Analysis System The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision CT inspection for accurate PCB and BGA analysis. This fully upgraded system performs comprehensive CT detection on BGA, CSP, ...

Detail Produk

Menyoroti:

FPD detector BGA defect analysis

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Unicomp SMT welding system

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X-ray head-in-pillow inspection

Name: Mesin Pemeriksaan Sinar-X Unicomp
Application: SMT, EMS,BGA, Elektronik, CSP, LED, Flip Chip, Semikonduktor
Industry: Industri elektronik
X-Ray Leakage: < 1uSv/jam
Deskripsi Produk
High-definition FPD Detector BGA Head-In-Pillow Defect AX9500 Unicomp SMT Welding Analysis System The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision CT inspection for accurate PCB and BGA analysis. This fully upgraded system performs comprehensive CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, plus SMT welding analysis with advanced 3D tomography CT scanning capabilities. Applications Semiconductor industry inspection SMT
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