Elektronik X Ray Mesin
Unicomp AX9100 X Ray Inspection Equipment 130KV Closed Tube FPD Image Untuk BGA PCBA
Unicomp AX9100 130KV closed tube X-ray with FPD image detector for BGA,PCBA,Diode and semicon inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W ...
AX9100 130kV Microfocus Electronics X Ray Machine Dengan FPD Oblique View 360 Rotation Table
AX9100 130kV microfocus X-ray with FPD oblique view and 360°rotation table for electronic components check Features of Unicomp AX9100: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2...
Unicomp offline penetrasi tinggi microfocus 130kV mesin Xray AX9100 untuk SMT PCBA CPU IC solder pemeriksaan kualitas
Unicomp offline high penetration microfocus 130kV Xray machine AX9100 for SMT PCBA CPU IC soldering quality inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D ...
Mesin X-ray PCB dengan perbesaran tinggi Unicomp AX9100MAX untuk pemeriksaan kabel ikatan komponen IC elektronik
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine ...
Mesin X-Ray Resolusi Tinggi AX8200MAX untuk pemeriksaan cacat bagian dalam Chip Semicon
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, ...
Peralatan Inspeksi Sinar X Unicomp AX8200MAX Untuk Semikonduktor
Unicomp AX8200 X Ray Inspection Equipment For Semiconductor Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110...
Unicomp Inline Electronics X Ray Machine 3.5kW Untuk Solder Semicon IGBT
Unicomp Inline Electronics X Ray Machine 3.5kW For IGBT Semicon Soldering Unicomp High Speed Inline 2D X-ray Inspection machine with cutting edge AI Algorithm For IGBT Semicon soldering void checking Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine ...
Peralatan Inspeksi Sinar-X Lanjutan untuk Industri Elektronik 1000kg Beban Maksimal
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION ...
Mesin Radiografi Digital & Mesin Sinar X Unicomp AX7900 Untuk Perbaikan Pcb Dan IC/BGA Ball Soldering Measurement&testing
Digital Radiography machine & x ray machine Unicomp AX7900 for pcb repair and IC/BGA ball soldering measurement&testing Description of IC X Ray machine AX7900: It is widely adopted across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductor ...
