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Elektronik X Ray Mesin

Kualitas Semikonduktor 110kV Elektronik X Ray Machine 5um AX8500 Untuk PCBA BGA Pabrik

Semikonduktor 110kV Elektronik X Ray Machine 5um AX8500 Untuk PCBA BGA

110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
Kualitas CSP SMT Electronics X Ray Machine 110kV Unicomp AX8500 Untuk SMT PCBA BGA QFN Pabrik

CSP SMT Electronics X Ray Machine 110kV Unicomp AX8500 Untuk SMT PCBA BGA QFN

Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
Kualitas 5um SMT X Ray Equipment CNC Programmable Untuk EMS BGA Voids Pabrik

5um SMT X Ray Equipment CNC Programmable Untuk EMS BGA Voids

5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
Kualitas Algoritma FPD Electronics X Ray Machine 1.0kW Untuk LED Reflow Solder Pabrik

Algoritma FPD Electronics X Ray Machine 1.0kW Untuk LED Reflow Solder

Unicomp newly released AX8200max X-ray machine with cutting-edge software algorithm for SMT BGA CSP QFN LED reflow solde Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3
Kualitas Mesin CNC Programmable 1.0 kW X Ray Untuk Paket PoP SMT BGA QFP Pabrik

Mesin CNC Programmable 1.0 kW X Ray Untuk Paket PoP SMT BGA QFP

X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
Kualitas Komponen Enkapsulasi Resistensi Mesin X Ray Elektronik 5μm Ukuran Spot Pabrik

Komponen Enkapsulasi Resistensi Mesin X Ray Elektronik 5μm Ukuran Spot

Factory Manufacturing X Ray Machine 5μM For Resistance Applications Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components EMS Semiconductor Electronics X Ray Machine System for BGA and CSP
Kualitas 2.5D 110kv X ray machine Unicomp AX8500 untuk pemeriksaan kualitas leadframe Semicon dengan pengukuran otomatis Pabrik

2.5D 110kv X ray machine Unicomp AX8500 untuk pemeriksaan kualitas leadframe Semicon dengan pengukuran otomatis

2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
Kualitas 5μm Microfocus X-ray dengan tampilan miring FPD 55 ° untuk memeriksa kekosongan penyolderan LED PCBA BGA QFN Pabrik

5μm Microfocus X-ray dengan tampilan miring FPD 55 ° untuk memeriksa kekosongan penyolderan LED PCBA BGA QFN

5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
Kualitas Unicomp AX8500 110kV 5um 2.5D X-ray untuk Elektronik SMT PCBA BGA IC solder pemeriksaan kualitas Pabrik

Unicomp AX8500 110kV 5um 2.5D X-ray untuk Elektronik SMT PCBA BGA IC solder pemeriksaan kualitas

Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)