bga x ray inspection system
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130kV microfocus X-ray dari Unicomp AX9100 untuk Inspeksi solder SMT PCBA BGA
130kV microfocus X-ray of Unicomp AX9100 for SMT PCBA BGA soldering Inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery
Unicomp AX9100 Pengukuran otomatis dengan pemrograman CNC peralatan X-Ray untuk kualitas solder PCBA BGA CSP QFN reflow
Unicomp AX9100 Automatic measurement with CNC programming X-Ray equipment for PCBA BGA CSP QFN reflow soldering quality Features of Unicomp AX9100: ● 90-130KV 7μm X-Ray tube.● High speed & Millions pixels high resolution FPD.● 1000X magnification, high-definition real-time image.● One-button operation with 2.5D image display.● Off-line programming function, navigation mode detection.● 7 axis linkage, 70 degree tilt detection.Applications of Unicomp AX9100: ● SMT, BGA, CSP,
Mesin Pemindai X Ray Pemetaan CNC AX8200 100KVUntuk Harness Konektor
Chinese leading X-ray Inspection System AX8200 for Connectors Harness Defects inspection with CNC MappingThe AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring
Mesin X Ray Desktop Jejak Kecil Ringkas Portabel Untuk Semikonduktor Elektronoik
Unicomp CX3000 Small footprint compact portable Desktop X-ray Machine For Electrnoics Semiconductor Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x
5 Um Micro Focus Unicomp X Ray Machine AX7900 Untuk Komponen IC Semicon
5 μm Micro focus X-Ray machines Unicomp AX7900 for semicon IC components wire bonding testing Description of AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
CX3000 Reel To Reel Electronics X Ray Machine 0.5kW Untuk CSP LED Flip Chip
Brand New Generation of CX3000 with Reel to Reel Function Making It More Competitive Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle
Mesin X-Ray PCB 90kV Resolusi Tinggi Unicomp AX7900 Untuk Komponen Elektronik
5 μm Micro focus X-Ray machines Unicomp AX7900 for semicon IC components wire bonding testing Description of AX7900 : 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.
CX3000 Benchtop Electronics X Ray Machine untuk BGA, CSP, LED & Semiconductor
CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor X ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. X ray Inspecting Features: (1) Coverage of process defects up to 97%.
Mesin Ray X Metal UNICOMP Untuk Konektivitas dan Analisis BGA AX9100
Metal X Ray Machine for BGA connectivity and analysis AX9100 Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
