logo
Selamat datang di Unicomp Technology
+86-13502802495
Ditemukan 440 produk untuk "

bga x ray machine

"
Kualitas CSP LED 110kV X Ray Scanner 5um Untuk Solder PCBA Strip LED Pabrik

CSP LED 110kV X Ray Scanner 5um Untuk Solder PCBA Strip LED

110kV 5um microfocus AX8500 X-ray for LED Strip PCBA soldering void quality control Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size

Kualitas 90kv X Ray Machine High Resolution Unicomp AX7900 Dengan 5um Tube Untuk BGA Bonding Wires Curvature Testing Pabrik

90kv X Ray Machine High Resolution Unicomp AX7900 Dengan 5um Tube Untuk BGA Bonding Wires Curvature Testing

90kv X ray machine high resolution Unicomp AX7900 with 5um tube for BGA bonding wires curvature testing Description of IC X Ray machine AX7900: It is broadly utilized in industries such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location

Kualitas Unicomp Microfocus X Ray Inspection System 130kV 3um Untuk Gambar FPD Pabrik

Unicomp Microfocus X Ray Inspection System 130kV 3um Untuk Gambar FPD

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power

Kualitas 130kV 3um Microfocus X Ray FPD Intensifier Untuk Solder Aluminium PCBA Pabrik

130kV 3um Microfocus X Ray FPD Intensifier Untuk Solder Aluminium PCBA

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●

Kualitas PCBA 5um Tube Unicomp X Ray AX7900 0.8KW Untuk Perakitan PCB Pabrik

PCBA 5um Tube Unicomp X Ray AX7900 0.8KW Untuk Perakitan PCB

Unicomp 5um close tube AX7900 X-ray for printed circuit board assembly PCBA process quality inspection of Void Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.

Kualitas High Power X-ray Detection Equipment Elektronik SMT BGA Semiconductor Pabrik

High Power X-ray Detection Equipment Elektronik SMT BGA Semiconductor

High Power X-ray Detection Equipment Electronics SMT BGA Semiconductor Today, Unicomp Technology has three R&D /Manufacturing sites exceeding 25,000m2 respectively located at Wuxi/Jiangsu Province, Shenzhen/Guangdong Province, and Chongqing. Our sales and service centers are located all across China including Beijing, Shenyang, Tianjin, Xi'an, Qingdao, Wuhan, Chengdu, Ningbo , Xiamen and etc. The company has also penetrated into the international market with sales and service

Kualitas SMT BGA Inspeksi X Ray Chip Counter 440mm Tunnel CE Pabrik

SMT BGA Inspeksi X Ray Chip Counter 440mm Tunnel CE

Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,

Kualitas CSP 130kV X Ray Security Scanner Inspeksi Otomatis Untuk NDT Keramik Pabrik

CSP 130kV X Ray Security Scanner Inspeksi Otomatis Untuk NDT Keramik

130kV clsoed tube X-ray system with convenient mapping process for ceramic NDT quality testing Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage

Kualitas AC 110/220V Power Supply Peralatan Inspeksi Sinar X Dengan Desain Tabung Disegel Pabrik

AC 110/220V Power Supply Peralatan Inspeksi Sinar X Dengan Desain Tabung Disegel

X-Ray Inspection Equipment Product Description: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Features: Large Size Inspection Table. Laser Pinpoint For Precise LocationLarge Size Inspection Accurate Control, CNC Programming Automatic Positioning FPD Tilting ±25° Safely Electromagnetic Interlock Fingerprint Access