electronic inspection equipment
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Mesin SMT PCBA Elektronik X Ray Unicomp Kecepatan Tinggi Sejalan Dengan Identifikasi Otomotif
Unicomp High Speed inline SMT PCBA X-Ray Inspection System with Automotive Identification OK / NG Result Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
Mesin X-Ray Resolusi Tinggi AX8200MAX untuk pemeriksaan cacat bagian dalam Chip Semicon
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic
China Unicomp 90KV X-ray dengan Sistem Inspeksi PFD HD untuk Pendeteksian Cacat Chipset
China Unicomp 90KV X-ray with HD PFD Inspection System for Chipset Defects Detecting Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming
90KV 5um microfocus tabung tertutup X-ray Inspection System dengan resolusi tinggi FPD untuk PCBA solder void Cacat checki
90KV 5um microfocus closed tube X-ray Inspection System with high resolution FPD for PCBA soldering void Defects checki Application Fields of X-ray machine Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of X-ray machie 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD
5um Resolusi Tinggi 90KV Unicomp X Ray FPD Detector Untuk Wire Harness
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
Unicomp AX8200Max X Ray Machine 6 Axis Manipulator Untuk Inspeksi yang Dapat Diprogram CNC
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
High Accuracy Porosity X-Ray Computed Tomography Machine Unicomp UNCT2600 For Engine Blades 3D CT Inspection
High accuracy porosity X-ray computed tomography machine Unicomp UNCT2600 for engine blades 3D CT inspectionProduct Description:The UNCT2600 is a compact and versatile industrial CT scanning system renowned for its high precision, catering to the diverse inspection needs across various industries. Predominantly utilized for examining small metal castings, non-ferrous metals, lithium-ion battery cells, microchips, electronic components, geological rock samples, cores, soil
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application
On-Line Operasi PCB X Ray Mesin Unicomp LX2000 Untuk Industri Photovoltaic
On-line operation PCB X Ray Machine Unicomp LX2000 for PCB , LED The LX-2000 is a versatile OnLine X-ray Machine designed for automated and semi-automated analysis. In addition to the OnLine capability, the LX-2000 can also be used in a Manual mode as a process monitoring/engineering workstation. OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life
