industrial inspection systems
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Peralatan Inspeksi Unicomp 320kV NDT X Ray Untuk Pengecoran Besi Aluminium
Dynamic Precise Casting Part Inspection Real Time X-ray Image System The UNC320 is the newest standard system. Whether you are inspecting small or large components, the UNC320 is the best option for customers needing a compact system with unique capabilities generally available on a larger X-ray or CT system. SYSTEM CAPABILITIES Advanced 2D X-ray inspection Overall Maximum System Resolution: ~5 microns 50cm diameter x 80cm tall nominal part envelope Comprehensive acquisition,
Sistem Inspeksi CT 3D X Ray Offline Unicomp AX9500 Untuk Inspeksi Lapisan PCB
3D X-Ray computed temography offline CT Inspection system unicomp AX9500 for PCB layers inspection Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT) Applications Widely Used in semiconductor, SMT, photovoltaic, ceramic products and other special industries, can also be used to detect auto parts, aluminum die-casting
Real Time Digital X-Ray Machine AX7900 untuk Inspeksi Capacitor internal cacat
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
Peralatan pemeriksaan sinar-X untuk PCB dengan konsumsi daya 1,0 kW 1280 L x 1220 W x 1615 H mm
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Inspection Table of Large Dimensions, Laser Pinpointing for Exact Positioning Precise Control
Bagian Otomotif UNC160 Inspeksi X-Ray Mesin Otomasi Penerbangan
UNC160 Automotive Parts X-ray Inspection Equipment Aviation Automation Features: ● Strong penetration,high reliable,low breakdown, long life; ● High definition,resolution FPD; ● Multi-functional workstation,360°rotation and shift; ● High automation,fast detection speed; ● User friendly software design for interfacing and to facilitate,customize software function development requirement. Applications: ● Cast parts and pressure Vessels ● Wheel,Tires and Metal parts ● Steel pipe
Compact NDT X Ray Cabinet System, Solusi Sistem Inspeksi Industri
Compact NDT X-ray Cabinet Equipment China Industrial Inspection Solutions The main focus of this compact X-ray cabinet for manual real-time inspection are sample parts. The goal is to achieve the same brilliant image quality for a budget price by reducing the comfort items and advanced features of the UNC130. This leads to the best cost-benefit ratio for our customers on the market. X-ray inspection is a necessary requirement to meet modern day production standards. For many
SMD Cable X Ray System, Peralatan Inspeksi Pcb AX8300 Untuk Komponen Elektronik
SMD Cable Electronics Components Unicomp PCB X Ray Machine AX8300 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Features: 110kV Microfocus x-ray source, High resolution FPD X/Y/Z/Tilt Motions (table, tube, FPD) 360° Table Rotation Angle View up to 70 Degrees
Stand Alone Void BGA X Ray Inspection Machine DXI Sistem Pemrosesan Gambar 40W
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system,
Mesin Inspeksi PCBA Solder BGA X Ray Kecepatan Tinggi Dengan Meja Sampel Besar
Application Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
