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Kualitas Mesin Pemindai Sinar X CSP BGA 100KV FPD Microfocus Tabung Tertutup AX8500 Pabrik

Mesin Pemindai Sinar X CSP BGA 100KV FPD Microfocus Tabung Tertutup AX8500

High resolution FPD with microfocus closed tube AX8500 X-ray system from Unicomp for LED inner bubble and void testing Technical Parameters and Specifications System SummaryFootprint1370(W)×1300(D)×1700(H)mmMachine Weight1600 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size1750(W)×1500(D)×2000(H)mmPacking Weight1800 kgPower Consumption2.0 kWX-Ray TubeTube TypeSealedMax. Power25WVoltage0~110kV (Adjustable)Focus Spot Size5μmImaging SystemDetectorFlat Panel Detector (FPD

Kualitas Semikonduktor 110kV Elektronik X Ray Machine 5um AX8500 Untuk PCBA BGA Pabrik

Semikonduktor 110kV Elektronik X Ray Machine 5um AX8500 Untuk PCBA BGA

110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)

Kualitas Unicomp AX8500 X Ray Inspection Machine Untuk Solder SMT EMS BGA LED CSP QFN Pabrik

Unicomp AX8500 X Ray Inspection Machine Untuk Solder SMT EMS BGA LED CSP QFN

Unicomp AX8500 X-ray inspection machine for SMT / EMS BGA LED CSP QFN soldering void measurement​ Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Kualitas 5um SMT X Ray Equipment CNC Programmable Untuk EMS BGA Voids Pabrik

5um SMT X Ray Equipment CNC Programmable Untuk EMS BGA Voids

5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)

Kualitas CSP SMT Electronics X Ray Machine 110kV Unicomp AX8500 Untuk SMT PCBA BGA QFN Pabrik

CSP SMT Electronics X Ray Machine 110kV Unicomp AX8500 Untuk SMT PCBA BGA QFN

Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel

Kualitas CSP LED X Ray Machine Closed Tube Flip Chip AX8500 Untuk Semikonduktor 100KV Pabrik

CSP LED X Ray Machine Closed Tube Flip Chip AX8500 Untuk Semikonduktor 100KV

Closed Tube Type AX8500 X Ray Machine for semiconductor Lead frame wiring bonding quality inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Kualitas SMT BGA Electronics Mesin X Ray FPD 1000X Pembesaran Unicomp AX8500 Pabrik

SMT BGA Electronics Mesin X Ray FPD 1000X Pembesaran Unicomp AX8500

Unicomp AX8500 X Ray with FPD Detector and 1000X Magnification to check Semiconductor components quality issue Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel

Kualitas Mesin CT 3D Inline Penetrasi Tinggi Mesin X Ray Untuk Pengujian PCB Unicomp LX9200 Pabrik

Mesin CT 3D Inline Penetrasi Tinggi Mesin X Ray Untuk Pengujian PCB Unicomp LX9200

High penetration inline 3D CT machine X-Ray machine for PCB testing Unicomp LX9200 with real-time display Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type:BGA,LGA,CSP,POP,SIP... Defect type:Void,HIP,Insufficient,Bridge... Semiconductor

Kualitas Mesin sinar-X NDT berkualitas Unicomp UNC225 dengan standar ASTM EN12543 untuk pengujian cacat peredam kejut Pabrik

Mesin sinar-X NDT berkualitas Unicomp UNC225 dengan standar ASTM EN12543 untuk pengujian cacat peredam kejut

Engine Blocks Brake Caliper Industrial Real Time X Ray Inspection Equipment Whether in the automotive, electronics or aircraft industry or for ship and vessel construction, Unicomp Technology is offering industrial X-ray inspection systems for nondestructive material testing which can fit in any manufacturing process and guarantee highest quality and safety standards for industrial products. 1. Full cycle support from products design to testing procedures and high-quality