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Monitor LCD 27" SMT EMS Penyolderan Cacat Peralatan Inspeksi Elektronik Resolusi Tinggi
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV 7µm closed X-ray tube, high speed & Millions ...
Mesin Inspeksi PCBA Solder BGA X Ray Kecepatan Tinggi Dengan Meja Sampel Besar
Application Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Features Max. loading area 645*670mm, max. inspection area ...
Unicomp AX7900 Micron Fokus Mesin X-Ray Untuk IC Komponen Bond Kabel Pengujian
Unicomp offline AX7900 X-ray machine with auto-mapping and BGA QFN LED soldering Void auto measurement Specifications of Unicomp offline AX7900 X-ray machine: System Summary Footprint 1215(W)×1325(D)×1700(H)mm Machine Weight 1240 kg Power Supply AC 220V, 50/60Hz Plywood Packing Size 1680(W)×1680(D)...
Real Time Digital X-Ray Machine AX7900 untuk Inspeksi Capacitor internal cacat
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovolta...
Mesin Radiografi Digital & Mesin Sinar X Unicomp AX7900 Untuk Perbaikan Pcb Dan IC/BGA Ball Soldering Measurement&testing
Digital Radiography machine & x ray machine Unicomp AX7900 for pcb repair and IC/BGA ball soldering measurement&testing Description of IC X Ray machine AX7900: It is widely adopted across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductor ...
Mesin PCBA Unicomp X Ray AX7900 FPD Resolusi Tinggi Untuk Pemeriksaan Kawat BGA Die Bond
PCBA X-Ray machine Unicomp AX7900 with high resolution FPD for BGA void IC die bond wire inspection Description of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & ...
Mesin X-Ray PCB 90kV Resolusi Tinggi Unicomp AX7900 Untuk Komponen Elektronik
5 μm Micro focus X-Ray machines Unicomp AX7900 for semicon IC components wire bonding testing Description of AX7900 : 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase...
Unicomp AX7900 High Specifications 2D 2.5D X-Ray Machine untuk pemeriksaan ponsel dan pemeriksaan retakan
High specifications electronic boards 2D & 2.5D X-ray machine Unicomp AX7900 for used cellphone quality inspection and cracks checking Description of IC X Ray machine AX7900: It is widely used in various fields, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, ...
