x ray imaging system
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Unicomp UNCT3200 High-Resolution 450KV 3D CT/Computer Tomography System For Engine Blades Castings Porosity Analysis (Sistem Tomografi 3D/komputerisasi dengan resolusi tinggi 450KV)
Unicomp UNCT3200 High-Resolution 450KV 3D CT/Computed Tomography System for Engine Blades Castings Porosity Analysis Product Overview UNCT3200 is a self-shielded, multi-purpose industrial CT computed tomography system designed to accommodate workpieces of various sizes and materials. This system meets industrial CT application demands across diverse industries and is specially engineered for high-precision inspection of medium and large products, including metal castings, non
Mesin X-Ray Resolusi Tinggi AX8200MAX untuk pemeriksaan cacat bagian dalam Chip Semicon
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic
China Unicomp 90KV X-ray dengan Sistem Inspeksi PFD HD untuk Pendeteksian Cacat Chipset
China Unicomp 90KV X-ray with HD PFD Inspection System for Chipset Defects Detecting Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming
Unicomp UNCT3200 320kV Sistem CT Industri untuk Inspeksi Lembar Mesin
Unicomp UNCT3200 High-Resolution 450KV 3D CT/Computed Tomography System for Engine Blades Castings Porosity Analysis Key Specifications Attribute Value Maximum tube voltage 320kV Maximum detected weight 100kg Imaging area ≤430mm×430mm Product Overview The UNCT3200 industrial CT testing equipment features a vertical dual-column structural design with a high-precision, solid marble base. Equipped with a high-energy split X-ray tube and large-format flat-panel detector, this
Mesin Inspeksi Xray Elektronik Sambungan Solder BGA Miring AX8300MAX Unicomp Analisis Void Otomatis
Tilt BGA Solder Joint Electronics X-ray Inspection Machine AX8300MAX Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Key Features Professional
Mesin Radiografi Digital & Mesin Sinar X Unicomp AX7900 Untuk Perbaikan Pcb Dan IC/BGA Ball Soldering Measurement&testing
Digital Radiography machine & x ray machine Unicomp AX7900 for pcb repair and IC/BGA ball soldering measurement&testing Description of IC X Ray machine AX7900: It is widely adopted across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics. FEATURES of IC Xray machine AX7900: Large Size Inspection Table
90kv Real-time High Precision X Ray Machine Unicomp AX7900 Untuk Pengendalian Kualitas PCBA
90kv real-time high precision X ray machine Unicomp AX7900 for PCBA quality control Description of IC X Ray machine AX7900: It is extensively used in various industries, encompassing BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, as well as Photovoltaics. FEATURES of IC Xray machine AX7900: Laser Pinpoint for Precise Location on Large-Scale Inspection Tables
5 Mikron Resolusi Tinggi 90kv Mesin Sinar X Unicomp AX7900 Dengan Tabung Lima Mikron Untuk Pengujian PCBA
5 micron high resolution 90kv X ray machine Unicomp AX7900 with five micron tube for PCBA testing Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location Accurate Control, CNC Programming
90kv X Ray Machine High Resolution Unicomp AX7900 Dengan 5um Tube Untuk BGA Bonding Wires Curvature Testing
90kv X ray machine high resolution Unicomp AX7900 with 5um tube for BGA bonding wires curvature testing Description of IC X Ray machine AX7900: It is broadly utilized in industries such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location
