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Elektronik X Ray Mesin

Kualitas Unicomp AX8200 Electronics X Ray Machine Konektor Harness Kabel Tabung Tertutup Pabrik

Unicomp AX8200 Electronics X Ray Machine Konektor Harness Kabel Tabung Tertutup

Cable Harness Connectors Quality Inspection by Unicomp AX8200 Microfocs X-ray with high resolution FPD Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is ...
Kualitas Semikonduktor 110kV Elektronik X Ray Machine 5um AX8500 Untuk PCBA BGA Pabrik

Semikonduktor 110kV Elektronik X Ray Machine 5um AX8500 Untuk PCBA BGA

110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing ...
Kualitas CSP SMT Electronics X Ray Machine 110kV Unicomp AX8500 Untuk SMT PCBA BGA QFN Pabrik

CSP SMT Electronics X Ray Machine 110kV Unicomp AX8500 Untuk SMT PCBA BGA QFN

Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight ...
Kualitas 5um SMT X Ray Equipment CNC Programmable Untuk EMS BGA Voids Pabrik

5um SMT X Ray Equipment CNC Programmable Untuk EMS BGA Voids

5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing ...
Kualitas Algoritma FPD Electronics X Ray Machine 1.0kW Untuk LED Reflow Solder Pabrik

Algoritma FPD Electronics X Ray Machine 1.0kW Untuk LED Reflow Solder

Unicomp newly released AX8200max X-ray machine with cutting-edge software algorithm for SMT BGA CSP QFN LED reflow solde Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables...
Kualitas Mesin CNC Programmable 1.0 kW X Ray Untuk Paket PoP SMT BGA QFP Pabrik

Mesin CNC Programmable 1.0 kW X Ray Untuk Paket PoP SMT BGA QFP

X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” ...
Kualitas Komponen Enkapsulasi Resistensi Mesin X Ray Elektronik 5μm Ukuran Spot Pabrik

Komponen Enkapsulasi Resistensi Mesin X Ray Elektronik 5μm Ukuran Spot

Factory Manufacturing X Ray Machine 5μM For Resistance Applications Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection BGA Inspection Inspection of over molded electrical ...
Kualitas 2.5D 110kv X ray machine Unicomp AX8500 untuk pemeriksaan kualitas leadframe Semicon dengan pengukuran otomatis Pabrik

2.5D 110kv X ray machine Unicomp AX8500 untuk pemeriksaan kualitas leadframe Semicon dengan pengukuran otomatis

2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm ...
Kualitas 5μm Microfocus X-ray dengan tampilan miring FPD 55 ° untuk memeriksa kekosongan penyolderan LED PCBA BGA QFN Pabrik

5μm Microfocus X-ray dengan tampilan miring FPD 55 ° untuk memeriksa kekosongan penyolderan LED PCBA BGA QFN

5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight ...