x ray detection systems
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Menerapkan sinar-X tabung dekat 5μm untuk memeriksa sel tombol Lithium yang dapat diisi ulang Wearable Electronics
Applying 5μm close tube X-ray to inspect Wearable Electronics rechargeable Lithium button cell Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging
Mesin sinar X Inline sepenuhnya otomatis Unicomp UNC160 untuk kendaraan listrik Inspeksi retakan perumahan baterai Li-ion
Fully automated Inline X ray machine Unicomp UNC160 for electric vehicles Li-ion battery housing cracks inspection System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight 50kg Work environment 5-40° ≤80%HR Install power Three-phase five wire system AC380V X-ray leakage dose rate ≤1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area
Gerakan CNC otomatis penuh dengan manipulator lengan C mesin sinar-X Unicomp UNC160 untuk pengujian perumahan pengecoran baterai lithium
Full automatic CNC motion with C arm manipulator Unicomp X-ray machine UNC160 for lithium battery casting housing testing Features: ● Strong penetration,high reliable,low breakdown, long life; ● High definition,resolution FPD; ● Multi-functional workstation,360°rotation and shift; ● High automation,fast detection speed; ● User friendly software design for interfacing and to facilitate,customize software function development requirement. Applications: ● Cast parts and pressure
1uSv / h 160KV Mesin Inspeksi X Ray 6kW Untuk Bagian Pengecoran Epoksi
UNC160 Automotive Parts X-ray Inspection Equipment Aviation Automation Features: ● Strong penetration,high reliable,low breakdown, long life; ● High definition,resolution FPD; ● User friendly software design for interfacing and to facilitate,customize software function development requirement; ● Multi-functional workstation,360°rotation and shift; ● High automation,fast detection speed. Applications: ● Cast parts and pressure Vessels ● Wheel,Tires and Metal parts ● Steel pipe
Mesin Epoxy Coran 6kW 160KV Industri X Ray UNC160
UNC160 Automotive Parts X-ray Inspection Equipment Aviation Automation Features: ● Strong penetration,high reliable,low breakdown, long life; ● High definition,resolution Flat Panel Detection (FPD); ● Multi-functional workstation,360°rotation and shift; ● High automation,fast detection speed; ● User friendly software design for interfacing and to facilitate,customize software function development requirement. Applications: ● Cast parts and pressure Vessels ● Wheel,Tires and
Mesin Inspeksi X Ray Chipset Motherboard Komputer CE AX9100
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
Resolusi Gambar Tinggi IC Unicomp Weld X Ray Mesin Inspeksi Microfocus
Unicomp--China Lead X-Ray Manufacturer'S Microfocus X-Ray With High Image Resolution For IC PCBA Soldering Inspection Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
SMT BGA Solder Void Pengukuran Mesin Sinar-X Microfocus 130kV
130kV 7 μm Microfovus X-Ray Machine For SMT BGA Soldering Void Measurement Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One
Pemrograman CNC Detektor Sinar X Otomatis Untuk PCBA BGA CSP QFN
Automatic Measurement With CNC Programming X-Ray Equipment For PCBA BGA CSP QFN Reflow Soldering Quality Inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Test Images: Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 5μm X-Ray tube. ●
