x ray metal inspection
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Sistem sinar-X Unicomp AX8200max dengan alat pengukuran ganda
Unicomp AX8200Max sistem pemeriksaan sinar-X mikrofokus untuk semikonduktor BGA IC SpenekananDariMesin sinar X SMT Ringkasan Sistem Jejak 1280 ((W) × 1500 ((D) × 1705 ((H) mm Berat mesin 1400 kg Sumber Daya AC 110 ~ 220V, 50/60Hz Ukuran Kemasan Kayu Lapis 175 ((W) × 155 ((D) × 200 ((H) cm Berat ...
AX8200max Elektronik Mesin Sinar X Dengan 6 sumbu 360 derajat Rotasi Opsional
Unicomp AX8200Max sistem pemeriksaan sinar-X mikrofokus untuk semikonduktor BGA IC SpenekananDariMesin sinar X SMT Ringkasan Sistem Jejak 1280 ((W) × 1500 ((D) × 1705 ((H) mm Berat mesin 1400 kg Sumber Daya AC 110 ~ 220V, 50/60Hz Ukuran Kemasan Kayu Lapis 175 ((W) × 155 ((D) × 200 ((H) cm Berat ...
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode ...
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and finds broad application across industries such as BGA/CSP/Flip Chip packaging, LED and optoelectronic component manufacturing, fuse and diode ...
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell The Unicomp AX9100max X-ray Machine is designed for EV Cylindrical Cell inspection and is widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, ...
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing ...
Peralatan Deteksi Bahan Unicomp Luar Negeri Sistem Rontok Keamanan Pangan Komoditi
Peralatan Deteksi Bahan Deteksi Sampah Unicomp Bahan Baku Keamanan Pangan Aplikasi: Pemeriksaan keamanan makanan (berlaku untuk semua jenis Daging, Buah, Sayuran dll. Inspeksi untuk partikel logam, Kaca chip, keramik, batu, tulang, plastik dan kotoran lainnya dll); Inspeksi komoditi (berlaku untuk ...
NDT Unicomp X Ray Systems UNC160-C-L X Ray Pengujian Coran 160KV
Sistem NDC Unicomp X-Ray UNC160-CL Die Castings Pipe Inspection Fitur: * Implementasi deteksi lokasi otomatis * Identifikasi deteksi cacat secara otomatis * Tanda identifikasi produk yang tidak memenuhi syarat * OK dan NG sedang menyortir dan memberi pengakuan * Kontras tinggi, deteksi gambar ...
Pengecoran Pengujian Mesin Sobek SMT EMS X Ray 225KV Ndt Testing Machine
Tes Tuang Merobek Metal X Ray Machine Quality Inspection di Turki Fitur: Kabinet berpihak X-Ray sesuai dengan peraturan internasional yang ketat untuk perangkat radiasi terlindung sepenuhnya. Kabinetnya benar-benar mandiri. Diproduksi di baja dengan pelindung timah lengkap. Dilengkapi dengan sumber ...
